TY  - CONF

T1  - Online non-intrusive curing identification of CFRP assisted by pattern recognition with a novel in-situ curing apparatus

JO  - 2019 IEEE International Conference on Systems, Man and Cybernetics (SMC)

PY  - 2019/10/01

AU  - Cedeno-Campos VM

AU  - Jaramillo PA

AU  - Fernyhough CM

AU  - Fairclough JPA

ED  - 

DO  - DOI: 10.1109/smc.2019.8914371

PB  - IEEE

Y2  - 2024/12/22

ER  -